Part Number Hot Search : 
C3198 TLP250 10393 M1520 AN1105 502CF AN157 2907A
Product Description
Full Text Search
 

To Download H2N5087 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 1/4
H2N5087
PNP EPITAXIAL PLANAR TRANSISTOR
Description
This device was designed for low noise,high gain,general purpose amplifier applications for 1uA to 25mA collector current.
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -50 V VCEO Collector to Emitter Voltage .................................................................................... -50 V VEBO Emitter to Base Voltage ............................................................................................ -3 V IC Collector Current ......................................................................................................... -50mA
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 *hFE3 fT Cob Min. -50 -50 -3 250 250 250 40 Typ. Max. -50 -50 -0.3 -0.85 800 4.0 Unit V V V nA nA V V Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-35V VEB=-3V IC=-10mA, IB=-1mA IC=-10mA, IB=-5V VCE=-5V, IC=-0.1mA VCE=-5V, IC=-1mA VCE=-5V, IC=-10mA IC=-0.5mA, VCE=-5V, f=100MHz VCB=-5V, f=1MHz
MHz pF
*Pulse Test : Pulse Width 380us, Duty Cycle2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 2/4
Saturation Voltage & Collector Current
Sat aton Volage ( V) ur i t m
hFE
hFE @ VCE=5V
100 VCE(sat) @ IC=10IB
100 0.1 1 10 100
10 1 10 100
C ol orC ur ent( A) l ect r m
C ol orC ur ent( A) l ect r m
On Voltage & Collector Current
1000
1000
Cutoff Frequency & Collector Current
C ut fFr of equency ( Hz) M
VBE(on) @ VCE=5V
O n Volage ( V) t m
fT @ VCE=5V
100
100 0.1 1 10 100
10 0.1 1 10 100
C ol orC ur ent( A) l ect r m
C ol orC ur ent( A) l ect r m
Capacitance & Reverse-Biased Voltage
10
Safe Operation Area
10
PT=1ms
C ol orC ur ent( l ect r A)
Capacitance (pF)
1
PT=100ms
PT=1s
Cob
0.1
1 1 10 100
0.01 1 10 100
Rever Bi se- ased Volage ( t V)
For d B i war ased Volage ( t V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 3/4
PD-Ta
700 600
Power Dissipation-PD(mW)
500 400 300 200 100 0 0 20 40 60 80 100
o
120
140
160
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
12 3
Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 4/4
2
Marking :
HSMC Logo Part Number Date Code Rank Product Series
3
Laser Mark
HSMC Logo Product Series
C
D
Part Number
H I E F
G
Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector
1
3-Lead TO-92 Plastic Package HSMC Package Code : A
*:Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification


▲Up To Search▲   

 
Price & Availability of H2N5087

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X